iPhone 7 Rumors: A10 Chips From TSMC To Make Thinnest Phone Ever
Apple launched iPhone 6S this month and people are already waiting for its delivery on September 25th. However, more iPhone 7 rumors are popping up, said Yahoo! News. Apple may be planning its thinnest phone ever, reported Inquisitr.
According to the latest reports from China, iPhone has already secured A10 processor chips for the phone to be launched next year. IT has chosen TSMC to supply these chips that will make the next iPhone and iPads ultra-thin, said Yahoo! News.
The new A10 processor chips are expected to be mass manufactured by March 2016 and the new iPhone will be slated for a launch at least 6 months thereafter. The Chinese news site, Commercial Times, said the A10 processor will be manufactured using 16nm FinFET technology. It will incorporate "in-house developed backend integrated fan-put (InFO) wafer-level packaging.
TSMC currently manufactured A8 processor chips that are currently being used in existing models of iPhones and iPads. The new iPhone 6S is using A9 processor which are partially bein manufactured by TSMC and other 50% production is being taken care by Samsung.
AppleInsider noted that the new iPhone 7 will be between 6 to 6.5 millimeters thick. This means that the new iPhone 7 will be a thick as existing iPad Air or the iPod Touch. Ming-Chi Kuo, an analyst with KGI Securities who is regarded as one of the most accurate when it comes to iPhone rumors remarked that such thin iPhone may not be able to support the new "super high definition" resolution. However the new iPhone may have some striking features like the G/G touch technology, reported Digitimes. Apple may be ready to launch to variants of the new phone - iPhone 7 and iPhone 7 Plus in 4.7 inch and 5.5 inch screen size, said MacRumors.
